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Complicated Modules Applied In Semiconductor Industry for Automatic Die Bonder

  • September 22, 2021

Since established in 2005, Far East Excellence has been engaged in producing and processing of precision parts and dies in the semiconductor industry. So far, it has accumulated valuable production experience and technology accumulation in the semiconductor industry.


Our Products


Modules for Die Bonder in Semicoductor


Technical Difficulties

a. The size requirements are high: size tolerance, 0.003mm, location, parallelism, etc.Flatness, perpendicularity, symmetry and profile 0.003mm.

b. The assembly is difficult and the assembly accuracy is high. There are dozens of machining and assembly dimensions.

Moreover, the tolerance is in the 0.003mm.

c. The whole process of tooling is CNC, grinding, turning, machining and boring.


Our Services

1. ON Time Delivery

2. Speedily Manufacturing

3. Strictly QA Control and 0 Complaint, Trust Us and Best Quality for you.

4. After-Sales Service in 1 year free.


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